Mask Aligner
Top/ bottom side / infrared alignment, Accurate and precise gap setting for higher yield, High-quality, diffraction reduction exposure optics for high resolution, Optimum edge quality with thick resist, Reliable sub-micron printing, Processing of fragile wafers and pieces, High intensity light sources reduce process time, High accuracy fixture and fixtureless bond alignment option, Aligned cold embossing option for full wafer printing of geometries in nanometer range, Near Field Holography option for one and two dimensional optical gratings, For wafers from 2"-150mm (substrates from 2"x2" to 6"x6"), Pieces down to a few millimeters
Suss | Site
Edmond J. Safra (Givat-Ram)
Nano Center
Contacts
- Golan Tanami
- golant@savion.huji.ac.il