K&S Wedge Wire Bonding
K&S Wedge Wire Bonding is an electronic bonding process used to connect two electrical circuits using a thin wire (such as gold or aluminum), creating a stable and durable connection. In this process, a machine called a Wedge Bonder is used, which forms a connection using a unique wedge-shaped tool at the end of the wire. The wedge pulls the wire into contact, and the heat and pressure applied during the process create a stable bond between the wire and the circuit.The K&S Wedge Wire Bonding system is primarily used in the semiconductor and electronics industries to establish electrical connections between chips (such as integrated circuits) and other components in the system. It is a critical process in the production of electronic chips, where high stability and durable connections are required.
Edmond J. Safra (Givat-Ram)
Nano Center
Contacts
- Golan Tanami
- golant@savion.huji.ac.il