AML Wafer Bonding System
The AML AWB04 Aligner Wafer Bonder System is a state-of-the-art device designed for precise bonding of wafers using thermocompression and anodic bonding techniques. It features unique in-situ alignment capabilities, accommodating wafers ranging from 3" to 6" in diameter, as well as smaller sample pieces, with alignment accuracy between 1 and 5 micrometers. The system supports the application of high voltages up to 2.5 kV and platen temperatures reaching 560°C, while exerting compression forces up to 40,000 N. It operates under high vacuum conditions down to 2×10?6 mBar and allows bonding processes under reactive gas atmospheres such as N2/H2 mixtures. This versatile bonder is utilized for bonding wafers of identical or different materials, including silicon (Si), silicon dioxide (SiO2), silicon coated with metals, and others, making it ideal for advanced semiconductor fabrication and microelectromechanical systems (MEMS) assembly. The system has been in operation since December 2020, providing reliable and highly precise wafer bonding solutions.
Center for Nanoscience and Nanotechnology | Site
Edmond J. Safra (Givat-Ram)
Nano Center
Contacts
- Golan Tanami
- golant@savion.huji.ac.il