ADT 7100 Dicing System
Optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.
The ADT 7100 Dicing System is a device used in the semiconductor industry and electronic component manufacturing for precise cutting of wafers or materials using a cutting blade. The Dicing system enables the accurate slicing of thin materials, such as silicon or other semiconductor substrates, with minimal distortion. The ADT 7100 is designed for cutting large silicon wafers into individual chips, maintaining high-quality cuts while preserving the material's properties. Equipped with powerful motors and advanced precision technologies, the system ensures extremely accurate cuts, which are crucial for the electrical and physical integrity of the chips. The ADT 7100 is widely used in semiconductor, memory technology, and electronic integration systems where high precision is required for cutting small silicon or other components.
ADT | Site
Edmond J. Safra (Givat-Ram)
Nano Center
Contacts
- Golan Tanami
- golant@savion.huji.ac.il